Published Date :2021-01-05 Pages :157 Category : Electronics and Semiconductors
Flexible Circuit Gaskets Chip Scale Package MarketByProduct Type (Tab Upside Down, Inner Wire Bonding) and Application (Bluetooth, WLAN, PMIC/PMU, MOSFET, Camera, Other)- Global Industry Analysis & Forecast to 2027,The Flexible Circuit Gaskets Chip Scale Package Markethas encountered significant development over the recent years and is anticipated to grow tremendously over the forecast period.Flexible circuits are members of electronic and interconnection family. They consist of a thin insulating polymer film having conductive circuit patterns affixed thereto and typically supplied with a thin polymer coating to protect the conductor circuits.
Published Date :2021-01-05 Pages :153 Category : Electronics and Semiconductors
Haptic Technology Product for Mobile Device Market by Type (Pressure Touch Part,Tactile Feedback Part, Other)Application (Tablet,Mobile Phone,Car Computer)- Global Industry Analysis & Forecast to 2027,Haptic Technology Product for Mobile DeviceMarket has encountered significant development over the recent years and is anticipated to grow tremendously over the forecast period.Haptic technology, also known as kinaesthetic communication or 3D touch, refers to any technology that, through the application of pressures, sensations, or movements to the user, may produce an impression of touch.
Code :SE0114643
Millimeter Wave Device Market By Type (Slow Wave Device, Fast Pass Device) and Application (Military Radar, Ultra High Speed Computer, Electronic Warfare, Satellite Communications, Others)- Global Industry Analysis & Forecast to 2027,The Millimeter Wave Device Markethas encountered significant development over the recent years and is anticipated to grow tremendously over the forecast period.Millimeter waves, also known as extremely high frequency (EHF), are a band of radio frequencies that is well suited for 5G networks. Compared to the frequencies below 5 GHz previously used by mobile devices, millimeter wave technology allows transmission on frequencies between 30 GHz and 300 GHz.
Published Date :2021-01-05 Pages :158 Category : Electronics and Semiconductors
RF Antenna Market By Type (Ultra Long Wave Antenna, Long wave Antenna, Medium Wave Antenna, Shortwave Antenna) and Application (Automobile, NFC, Aerospace and Defense, Consumer Electronics, Others)- Global Industry Analysis & Forecast to 2027,The RF Antenna Markethas encountered significant development over the recent years and is anticipated to grow tremendously over the forecast period.Antennas are much more than simple devices connected to every radio. They're the transducers that convert the voltage from a transmitter into a radio signal. And they pick radio signals out of the air and convert them into a voltage for recovery in a receiver.
Published Date :2021-01-05 Pages :157 Category : Electronics and Semiconductors
System-in-Package Technology Market By Product Type (2-D IC Packaging, 2.5-D IC Packaging, 3-D IC Packaging) and Application (Consumer Electronics, Automobile, Telecommunications, Wireless Communication)- Global Industry Analysis & Forecast to 2027,The System-in-Package Technology Markethas encountered significant development over the recent years and is anticipated to grow tremendously over the forecast period.A system in a package (SiP) or system-in-package is a number of integrated circuits enclosed in one or more chip carrier packages that may be stacked using package on package. The SiP performs all or most of the functions of an electronic system, and is typically used inside a mobile phone, digital music player, etc.
Published Date :2021-01-04 Pages :165 Category : Electronics and Semiconductors
Antimicrobial Thermometer Market by Type(Digital, Manual)Application (Food, Medical, Other)- Global Industry Analysis & Forecast to 2027,Antimicrobial ThermometerMarket has encountered significant development over the recent years and is anticipated to grow tremendously over the forecast period.Using a thermoresis device in which the electrical resistance changes in response to temperature changes, electronic thermometers track changes in temperature. This system may be a thermistor or a thermocouple and is built into a probe's edge. Thermistors are very tiny and thus respond quickly to temperature variations.
Published Date :2021-01-04 Pages :158 Category : Electronics and Semiconductors
GaAs Wafer and Epiwafer Market By Product Type (4-6 Inches, 12 Inches) and Application (RF, LED, PV, VCSEL, EELs)- Global Industry Analysis & Forecast to 2027,The GaAs Wafer and Epiwafer Markethave encountered significant development over the recent years and is anticipated to grow tremendously over the forecast period.An epitaxial wafer also called epi wafer,epi-wafer, or epiwaferis a wafer of semiconducting material made by epitaxial growth (epitaxy) for use in photonics, microelectronics, spintronics, or photovoltaics. The epi layer may be the same material as the substrate, typically monocrystaline silicon, or it may be a more exotic material with specific desirable qualities.
Published Date :2021-01-04 Pages :152 Category : Electronics and Semiconductors
Industrial Power Modules Market By Type (DC, AC) and Application (Military Industry Electric Power, Ship, Medical Treatment) Industry Outlook and Trend Analysis,The Industrial Power Modules Markethas encountered significant development over the recent years and is anticipated to grow tremendously over the forecast period.To meet the challenge of designing power sub-systems, many designers are considering using power modules instead of traditional discrete POL designs, with time to market, size constraints, reliability and design capabilities being motivating factors.
Published Date :2021-01-04 Pages :157 Category : Electronics and Semiconductors
Mobile Camera Module Market By Product Type (Built-in, External) and Application (Front Camera, Rear Camera)- Global Industry Analysis & Forecast to 2027,The Mobile Camera Module Markethas encountered significant development over the recent years and is anticipated to grow tremendously over the forecast period.Mobile camera module provides functions to take photos and videos via mobile devices such as smartphones, as well as on automobiles and smart home appliances. High-level technologies are required for mobile devices as they become small and slim, and as customers demand high resolution and multiple functions.
Published Date :2021-01-04 Pages :157 Category : Electronics and Semiconductors
Wafer Level Chip Scale Packaging (WLCSP) MarketByProduct Type (Redistribution, Molded Substrate) and Application (Bluetooth, WLAN, PMIC/PMU, MOSFET, Camera, Other)- Global Industry Analysis & Forecast to 2027,The Wafer Level Chip Scale Packaging (WLCSP) Markethas encountered significant development over the recent years and is anticipated to grow tremendously over the forecast period.Traditional LEDs usually undergo from the chip/die manufacturing to packaging processes where the die would be attached to an interposer such as a ceramic substrate, yielding a packaged LED or what is commonly referred to as an LED package.
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